WebThe Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. SSOP lead counts …

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Small-outline no-lead package SSOP: Shrink small-outline package: TSOP: Thin small-outline package: TSSOP: Thin shrink small-outline package: TVSOP: Thin very-small-outline package: VSOP Very-small-outline package: VSSOP Very-thin shrink small-outline package: Also referred as MSOP = micro … See more Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some … See more A variety of techniques for interconnecting several chips within a single package have been proposed and researched: • SiP (system in package) • PoP (package on package See more • Electronics portal • Surface-mount technology • Three-dimensional integrated circuit See more • MELF: Metal electrode leadless face (usually for resistors and diodes) • SOD: Small-outline diode. • SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). See more Surface-mount C Clearance between IC body and PCB H Total height T Lead thickness L Total carrier length LW … See more Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather … See more • JEDEC JEP95 official list of all (over 500) standard electronic packages • Fairchild Index of Package Information • An illustrated listing of different package types, with links to typical dimensions/features of each See more WebMar 23, 2016 · SOP vs SSOP - posted in Documentation & Document Control: Disclaimer - I know there was 1, maybe 2 other topics with this subject but neither were exactly what Im looking for. Theyre also over 6 years old and I didnt want to bump up that old of a thread. For info - we are a distributor of wild foods and seafood, going for Primus GFSI level 1 … laylas coughing spells

PowerPAD™ Thermally Enhanced Package

WebThe Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. WebAug 9, 2009 · Any food industry can nicely use this material to create its own SOP and/or SSOP by simple modification. By the way, IMHO, there was no need to introduce a new … WebPlastic leadframe package for tight space requirements. TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic … laylas effingham